By Hao Yu,Chuan-Seng Tan,Chuan Seng Tan
3D integration is an rising expertise for the layout of many-core microprocessors and reminiscence integration. This booklet, Advances in 3D built-in Circuits and Systems, is written to assist readers comprehend 3D built-in circuits in 3 phases: machine fundamentals, procedure point administration, and actual designs.
Contents provided during this ebook comprise fabrication options for 3D TSV and 2.5D TSI; equipment modeling; actual designs; thermal, energy and I/O administration; and 3D designs of sensors, I/Os, multi-core processors, and memory.
Advanced undergraduates, graduate scholars, researchers and engineers may perhaps locate this article valuable for figuring out the various demanding situations confronted within the improvement and development of 3D built-in circuits and systems.
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Additional info for Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems)
Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems) by Hao Yu,Chuan-Seng Tan,Chuan Seng Tan